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    Fabrication_GB_MS_20240826_ProtocolDifferences
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    • Single layer (PDMS chip) fabrication
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    Fabrication_GB_MS_20240826_ProtocolDifferences

    Monday, 8/26/2024INTRODUCTIONPROCEDUREDifferences introduced (vs protocol)1724744324848.jpg1724744324831.jpg20240826_143944.jpg20240826_143952.jpgPreparationFabricationDM WafersEQM WafersOUTCOMESPDMS Chip inventory
    Monday, 8/26/2024
    INTRODUCTION
    Assuring the current protocol works, the following chips are fabricated to increase height to 4-5mm vs the previous achieved height of 2-3mm, based on 2 factors;
    ●
    Steady PDMS total volume
    ●
    Losses during pouring
    PROCEDURE
    Differences introduced (vs protocol)
    ●
    Aluminum foil was NOT used for the petri dishes, as a well cleaned, glass dish was sufficient for the procedure and decreased the losses of PDMS volume
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    A thin, bendable silicone spatula was used to pour the PDMS into the wafer and minimized losses almost to 0%. Pictures depict the used spatula, which has been stored with the glass petri dishes used for fabrication. (Soon to be added in the Inventory doc.)
    1724744324848.jpg
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    1724744324831.jpg
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    ●
    The following pictures show the technique that was used to cover the wafer with aluminium foil to reduce radius by ~1 cm and ensure no leakage.
    20240826_143944.jpg
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    20240826_143952.jpg
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    Preparation
    ●
    Clean the glass petri dishes using ethanol or acetone
    Fabrication
    ●
    Time in the desiccator: 45'
    ●
    Baking time: 30'
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    Time in the desiccator: 30'
    ●
    Baking time: 30'
    OUTCOMES
    ●
    Chips #29 - 36 (DM) came out in good condition with a height of 4mm (#29 - 30) and 4.5mm (#31 - 36)
    ○
    Chip #28 didn't make it through, it was ruptured during cutting.
    ●
    Chips #37 - 43 (EQM) came out in good condition with consistent chip height / wafer equaling to 4.5mm (#37 - 39) and 5mm (#40 - 43).
    ○
    They also needed less time at the desiccator

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